View X122606_4858566.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

1 ? fn8098.3 caution: these devices are sensitive to electrosta tic discharge; follow proper ic handling procedures. 1-888-intersil or 1-888-468-3774 | intersil (and design) is a registered trademark of intersil americas inc. copyright intersil americas inc. 2005-2006. all rights reserved all other trademarks mentioned are the property of their respective owners. x1226 4k (512 x 8), 2-wire ? rtc real time clock/ca lendar with eeprom features ? real time clock/calendar ?tracks time in hours, minutes, and seconds ?day of the week, day, month, and year ? 2 polled alarms (non-volatile) ?settable on the second, minute, hour, day of the week, day, or month ?repeat mode (periodic interrupts) ? oscillator compensation on chip ?internal feedback resistor and compensation capacitors ?64 position digitally controlled trim capacitor ?6 digital frequency adjustment settings to 30ppm ? battery switch or super cap input ? 512 x 8 bits of eeprom ?64-byte page write mode ?8 modes of block lock? protection ?single byte write capability ? high reliability ?data retention: 100 years ?endurance: 100,000 cycles per byte ? 2-wire? interface interoperable with i 2 c ?400khz data transfer rate ? frequency output (sw se lectable: off, 1hz, 4096hz or 32.768khz) ? low power cmos ?1.25a operating current (typical) ? small package options ?8 ld soic and 8 ld tssop ? repetitive alarms ? temperature compensation ? pb-free plus anneal available (rohs compliant) applications ? utility meters ? hvac equipment ? audio/video components ? set top box/television ?modems ? network routers, hubs, switches, bridges ? cellular infrastructure equipment ? fixed broadband wireless equipment ? pagers/pda ? pos equipment ? test meters/fixtures ? office automation (copiers, fax) ? home appliances ? computer products ? other industrial/m edical/automotive description the x1226 device is a real time clock with clock/calendar, two polled alarms with integrated 512x8 eeprom, oscillator co mpensation, and battery backup switch. the oscillator uses an external, low-cost 32.768khz crystal. all compensation and trim components are integrated on the chip. this eliminates several external discrete components and a trim capacitor, saving board area and component cost. block diagram x1 x2 oscillator frequency timer logic divider calendar 8 control/ registers 1hz time keeping registers alarm regs compare mask control decode logic alarm (eeprom) (eeprom) scl sda serial interface decoder 4k eeprom array registers status (sram) select phz/irq v cc v back 32.768khz (sram) battery circuitry switch osc compensation data sheet may 8, 2006
2 fn8098.3 may 8, 2006 pin configuration ordering information part number part marking v dd (v) temp range (c) package pkg. dwg. # x1226s8* x1226 2.7 to 5.5 0 to 70 8 ld soic (150 mil) mdp0027 x1226s8z* (note) x1226z 0 to 70 8 ld soic (150 mil) (pb-free) mdp0027 x1226s8i* x1226i -40 to 85 8 ld soic (150 mil) mdp0027 x1226s8iz* (note) x1226zi -40 to 85 8 ld soic (150 mil) (pb-free) mdp0027 x1226v8* 1226 0 to 70 8 ld tssop (4.4mm) m8.173 x1226v8z* (note) 1226z 0 to 70 8 ld tssop (4.4mm) (pb-free) m8.173 x1226v8i* 1226i -40 to 85 8 ld tssop (4.4mm) m8.173 x1226v8iz* (note) 1226iz -40 to 85 8 ld tssop (4.4mm) (pb-free) m8.173 *add "t1" suffix for tape and reel. note: intersil pb-free plus anneal products employ special pb-free material sets; mo lding compounds/die attach materials and 100 % matte tin plate termination finish, which are rohs compliant and compatible with both snpb and pb-free soldering operations. intersil pb-free p roducts are msl classified at pb-free peak reflow temper atures that meet or exceed the pb-free requirements of ipc/jedec j std-020. x1 x2 v back v cc phz/irq scl sda v ss 1 2 3 4 7 8 6 5 8 ld tssop x1 x2 v back v cc phz/irq scl sda v ss 1 2 3 4 7 8 6 5 8 ld soic x1226
3 fn8098.3 may 8, 2006 pin assignments pin number symbol brief description soic tssop 13x1 x1. the x1pin is the input of an inverting amplifier. an external 32.768khz quartz crystal is used with the x1226 to supply a timebase for the real time clock. the recommended crystal is a citizen cfs206-32.768kdzf. internal compensation circuitry is included to form a complete oscillator circuit. care should be taken in the placement of the crystal and the layout of the circuit. plenty of ground plane around the device and short traces to x1 are highly recommended. see application section for more recommendations. 24x2 x2. the x2 pin is the output of an inverting amplifier. an external 32.768khz quartz crystal is used with the x1226 to supply a timebase for the real time clock. the recommended crystal is a citizen cfs206-32.768kdzf. internal compensation circuitry is included to form a complete oscillator circuit. care should be taken in the placement of the crystal and the layout of the circuit. plenty of ground plane around the device and short traces to x2 are highly recommended. see application section for more recommendations. 3 5 phz/irq programmable frequency/interrupt output ? phz/irq . this is either an output from the internal oscillator or an interrupt signal output. it is an open drain output. when used as frequency output, this signal has a frequency of 32.768khz, 4096hz, 1hz or inactive. when used as interrupt output, this signal notifies a host processor that an alarm has occurred and an action is required. it is an active low output. the control bits for this function are fo1 and fo0 and are found in address 0011h of the clock control memory map. see ?programmable frequency output bits?fo1, fo0? on page 9. 46v ss v ss . 57sda serial data (sda). sda is a bidirectional pin used to transfer data into and out of the device. it has an open drain output and may be wire ored with other open drain or open collector outputs. the input buffer is always active (not gated). an open drain output requires the use of a pull- up resistor. the output circuitry controls the fall time of the output signal with the use of a slope controlled pull-down. the circuit is designed for 400khz 2-wire interface speed. 68scl serial clock (scl). the scl input is used to clock all data into and out of the device. the input buffer on this pin is always active (not gated). 71v back v back . this input provides a backup supply voltage to the device. v back supplies power to the device in the event the v cc supply fails. this pin can be connected to a battery, a supercap or tied to ground if not used. 82v cc v cc . x1226
4 fn8098.3 may 8, 2006 description (continued) the real-time clock keeps track of time with separate registers for hour s, minutes, seconds. the calendar has separate registers for date, month, year and day-of-week. the calendar is correct through 2099, with automatic leap year correction. the powerful dual alarms can be set to any clock/calendar value for a match. for instance, every minute, every tuesday, or 5:23 am on march 21. the alarms can be polled in the status register or provide a hardware interrupt (irq pin). there is a repeat mode for the alarms allowing a periodic interrupt. the phz/irq pin may be software selected to provide a frequency output of 1 hz, 4096 hz, or 32,768 hz. the device offers a backup power input pin. this v back pin allows the device to be backed up by battery or supercap. the entire x1226 device is fully operational from 2.7 to 5.5 volts and the clock/calendar portion of the x1226 device remains fully operational down to 1.8 volts (standby mode). the x1226 devi ce provides 4k bits of eeprom with 8 modes of blocklock? contro l. the blocklock allows a safe, secure memory for critical user and configuration data, while allowing a large user storage area. pin descriptions serial clock (scl) the scl input is used to clock all data into and out of the device. the input buffer on this pin is always active (not gated). serial data (sda) sda is a bidirectional pin used to transfer data into and out of the device. it has an open drain output and may be wire ored with other open drain or open collector outputs. the input buffer is always active (not gated). an open drain output requires the use of a pull-up resistor. the output circuitry controls the fall time of the output signal with the use of a slope controlled pull-down. the circuit is designed for 400khz 2-wire interface speed. v back this input provides a backup supply voltage to the device. v back supplies power to the device in the event the v cc supply fails. this pin can be connected to a battery, a supercap or tied to ground if not used. programmable frequency/interrupt output ? phz/irq this is either an output from the internal oscillator or an interrupt signal output. it is an open drain output. when used as frequency output, this signal has a frequency of 32.768khz, 4096hz, 1hz or inactive. when used as interrupt output, this signal notifies a host processor that an alarm has occurred and an action is required. it is an active low output. the control bits for this function are fo1 and fo0 and are found in address 0011h of the clock control mem- ory map. see ?programmable frequency output bits?fo1, fo0? on page 9. x1, x2 the x1 and x2 pins are the input and output, respectively, of an invert ing amplifier. an external 32.768khz quartz crystal is used with the x1226 to supply a timebase for the real time clock. the recommended crystal is a citizen cfs206-32.768kdzf. internal compensation circui try is included to form a complete oscillator circuit. care should be taken in the placement of the crystal and the layout of the circuit. plenty of ground plane around the device and short traces to x1 and x2 are highly recommended. see application section for more recommendations. figure 1. recommended crystal connection nc = no internal connection x1 x2 v back v cc phz/irq scl sda v ss 1 2 3 4 7 8 6 5 8 ld tssop x1226 x1 x2 v back v cc phz/irq scl sda v ss 1 2 3 4 7 8 6 5 8 ld soic x1 x2 x1226
5 fn8098.3 may 8, 2006 power control operation the power control circuit accepts a v cc and a v back input. the power control circuit powers the clock from v back when v cc < v back ? 0.2v. it will switch back to power the device from v cc when v cc exceeds v back . figure 2. power control real time clock operation the real time clock (rtc) uses an external 32.768khz quartz crystal to maintain an accurate inter- nal representation of the second, minute, hour, day, date, month, and year. the rtc has leap-year correc- tion. the clock also corrects for months having fewer than 31 days and has a bit that controls 24 hour or am/pm format. when the x1226 powers up after the loss of both v cc and v back , the clock will not operate until at least one byte is wr itten to the clock register. reading the real time clock the rtc is read by initiating a read command and specifying the address corresponding to the register of the real time clock. the rtc registers can then be read in a sequential read mode. since the clock runs continuously and a read takes a finite amount of time, there is the possibility that the clock could change during the course of a read operation. in this device, the time is latched by the read command (falling edge of the clock on the ack bit prior to rtc data output) into a separate latch to avoid time changes during the read operation. the clock continues to run. alarms occurring during a read are unaffected by the read operation. writing to the real time clock the time and date may be set by writing to the rtc registers. to avoid changing the current time by an uncompleted write operation, the current time value is loaded into a separate buffer at the falling edge of the clock on the ack bit before the rtc data input bytes, the clock continues to run. the new serial input data replaces the values in the buffer. this new rtc value is loaded back into the rtc register by a stop bit at the end of a valid write sequence. an invalid write operation aborts the time update procedure and the contents of the buffer are di scarded. after a valid write operation the rtc will reflec t the newly loaded data beginning with the next ?one second? clock cycle after the stop bit is written. the rtc continues to update the time while an rtc regist er write is in progress and the rtc continues to run during any nonvolatile write sequences. a single byte may be written to the rtc without affecting the other bytes. accuracy of the real time clock the accuracy of the real time clock depends on the frequency of the quartz crystal that is used as the time base for the rtc. since the resonant frequency of a crystal is temperature dependent, the rtc perfor- mance will also be dependent upon temperature. the frequency deviation of the crystal is a fuction of the turnover temperature of the crystal from the crystal?s nominal frequency. for example, a >20ppm frequency deviation translates into an accuracy of >1 minute per month. these parameters are available from the crystal manufacturer. intersil?s rt c family provides on-chip crystal compensation net works to adjust load- capacitance to tune oscill ator frequency from +116 ppm to -37 ppm when using a 12.5 pf load crystal. for more detail information see the application section. clock/control registers (ccr) the control/clock registers are located in an area separate from the eeprom array and are only accessible following a slave byte of ?1101111x? and reads or writes to addresses [0000h:003fh]. the clock/control memory ma p has memory addresses from 0000h to 003fh. the defined addresses are described in the table 1. writing to and reading from the undefined addresses are not recommended. ccr access the contents of the ccr can be modified by perform- ing a byte or a page write operation directly to any address in the ccr. prior to writing to the ccr (except the status register), however, the wel and rwel bits must be set using a two step process (see section ?writing to the clock/control registers.?) the ccr is divided into 5 sections. these are: 1. alarm 0 (8 bytes; non-volatile) 2. alarm 1 (8 bytes; non-volatile) 3. control (4 bytes; non-volatile) 4. real time clock (8 bytes; volatile) 5. status (1 byte; volatile) each register is read and written through buffers. the non-volatile portion (or the counter portion of the rtc) is updated only if rwel is set and only after a valid write operation and stop bit. a sequential read or page write operation provides access to the contents of only one section of the ccr per operation. access to another sec- tion requires a new operation. continued reads or writes, v back in voltage v cc on off x1226
6 fn8098.3 may 8, 2006 once reaching the end of a section, will wrap around to the start of the section. a read or write can begin at any address in the ccr. it is not necessary to set t he rwel bit prior to writing the status register. section 5 (status register) supports a single byte read or wr ite only. continued reads or writes from this section terminates the operation. the state of the ccr can be read by performing a ran- dom read at any address in the ccr at any time. this returns the contents of that register location. additional registers are read by perfor ming a sequential read. the read instructio n latches all clock registers into a buffer, so an update of t he clock does not change the time being read. a sequential read of the ccr will not result in the output of dat a from the memory array. at the end of a read, the master supplies a stop condition to end the operation and free the bus. after a read of the ccr, the address remains at the previous address +1 so the user can execut e a current address read of the ccr and continue reading the next register. table 1. clock/control memory map addr. type reg name bit range default 76543210 (optional) 003f status sr bat al1 al0 0 0 rwel wel rtcf 01h 0037 rtc (sram) y2k 0 0 y2k21 y2k20 y2k13 0 0 y2k10 19/20 20h 0036 dw 0 0 0 0 0 dy2 dy1 dy0 0-6 00h 0035 yr y23 y22 y21 y20 y13 y12 y11 y10 0-99 00h 0034 mo 0 0 0 g20 g13 g12 g11 g10 1-12 00h 0033 dt 0 0 d21 d20 d13 d12 d11 d10 1-31 00h 0032 hr mil 0 h21 h20 h13 h12 h11 h10 0-23 00h 0031 mn 0 m22 m21 m20 m13 m12 m11 m10 0-59 00h 0030 sc 0 s22 s21 s20 s13 s12 s11 s10 0-59 00h 0013 control (eeprom) dtr 0 0 0 0 0 dtr2 dtr1 dtr0 00h 0012 atr 0 0 atr5 atr4 atr3 atr2 atr1 atr0 00h 0011 int im al1e al0e fo1 fo0 x x x 00h 0010 bl bp2 bp1 bp0 0 0 0 0 0 00h 000f alarm1 (eeprom) y2k1 0 0 a1y2k21 a1y2k20 a1y2k13 0 0 a1y2k10 19/20 20h 000e dwa1 edw1 0 0 0 0 dy2 dy1 dy0 0-6 00h 000d yra1 unused - default = rtc year value (no eeprom ) - future expansion 000c moa1 emo1 0 0 a1g20 a1g13 a1g12 a1g11 a1g10 1-12 00h 000b dta1 edt1 0 a1d21 a1d20 a1d13 a1d12 a1d11 a1d10 1-31 00h 000a hra1 ehr1 0 a1h21 a1h20 a1h13 a1h12 a1h11 a1h10 0-23 00h 0009 mna1 emn1 a1m22 a1m21 a1m20 a1m13 a1m12 a1m11 a1m10 0-59 00h 0008 sca1 esc1 a1s22 a1s21 a1s20 a1s13 a1s12 a1s11 a1s10 0-59 00h 0007 alarm0 (eeprom) y2k0 0 0 a0y2k21 a0y2k20 a0y2k13 0 0 a0y2k10 19/20 20h 0006 dwa0 edw0 0 0 0 0 dy2 dy1 dy0 0-6 00h 0005 yra0 unused - de fault = rtc year value (no eeprom) - future expansion 0004 moa0 emo0 0 0 a0g20 a0g13 a0g12 a0g11 a0g10 1-12 00h 0003 dta0 edt0 0 a0d21 a0d20 a0d13 a0d12 a0d11 a0d10 1-31 00h 0002 hra0 ehr0 0 a0h21 a0h20 a0h13 a0h12 a0h11 a0h10 0-23 00h 0001 mna0 emn0 a0m22 a0m21 a0m20 a0m13 a0m12 a0m11 a0m10 0-59 00h 0000 sca0 esc0 a0s22 a0s21 a0s20 a0s13 a0s12 a0s11 a0s10 0-59 00h x1226
7 fn8098.3 may 8, 2006 alarm registers there are two alarm registers whose contents mimic the contents of the rtc register, but add enable bits and exclude the 24 hour time selection bit. the enable bits specify which registers to use in the comparison between the alarm and real time registers. for example: ? setting the enable month bit (emon*) bit in combi- nation with other enable bits and a specific alarm time, the user can establish an alarm that triggers at the same time once a year. *n = 0 for alarm 0: n = 1 for alarm 1 when there is a match, an alarm flag is set. the occur- rence of an alarm can be determined by polling the al0 and al1 bits or by enabling the irq output, using it as hardware flag. the alarm enable bits are located in the msb of the particular register. when all enable bits are set to ?0?, there are no alarms. ? the user can set the x1226 to alarm every wednes- day at 8:00 am by setting the edwn*, the ehrn* and emnn* enable bits to ?1? and setting the dwan*, hran* and mnan* alarm registers to 8:00 am wednesday. ? a daily alarm for 9:30pm results when the ehrn* and emnn* enable bits are set to ?1? and the hran* and mnan* registers are set to 9:30 pm. *n = 0 for alarm 0: n = 1 for alarm 1 real time clock registers clock/calendar registers (s c, mn, hr, dt, mo, yr) these registers depict b cd representations of the time. as such, sc (seconds) and mn (minutes) range from 00 to 59, hr (hour) is 1 to 12 with an am or pm indicator (h21 bit) or 0 to 23 (with mil = 1), dt (date) is 1 to 31, mo (month) is 1 to 12, yr (year) is 0 to 99. date of the week register (dw) this register provides a day of the week status and uses three bits dy2 to dy0 to represent the seven days of the week. the counter advances in the cycle 0-1-2-3-4-5-6-0-1-2-? the assignment of a numerical value to a specific day of the week is arbitrary and may be decided by the system software designer. the default value is defined as ?0?. 24 hour time if the mil bit of the hr regi ster is 1, the rtc uses a 24-hour format. if the mil bit is 0, the rtc uses a 12- hour format and h21 bit functions as an am/pm indicator with a ?1? representing pm. the clock defaults to standard time with h21 = 0. leap years leap years add the day february 29 and are defined as those years that are divisible by 4. years divisible by 100 are not leap years, unless they are also divisi- ble by 400. this means that the year 2000 is a leap year, the year 2100 is not. the x1226 does not correct for the leap year in the year 2100. status register (sr) the status register is located in the ccr memory map at address 003fh. this is a volatile register only and is used to control the wel and rwel write enable latches, read power status and two alarm bits. this register is separate from both the array and the clock/control registers (ccr). table 2. status register (sr) bat: battery supply?volatile this bit set to ?1? indicates that the device is operating from v back , not v cc . it is a read-only bit and is set/reset by hardware (x1226 internally). once the device begins operating from v cc , the device sets this bit to ?0?. al1, al0: alarm bits?volatile these bits announce if either alarm 0 or alarm 1 match the real time clock. if there is a match, the respective bit is set to ?1?. the falling ed ge of the last data bit in a sr read operation resets th e flags. note: only the al bits that are set when an sr read starts will be reset. an alarm bit that is set by an alarm occurring during an sr read operation will remain set after th e read opera- tion is complete. rwel: register write enable latch?volatile this bit is a volatile latch that powers up in the low (disabled) state. the rwel bi t must be set to ?1? prior to any writes to the clock/co ntrol registers. writes to rwel bit do not cause a nonvolatile write cycle, so the device is ready for the next operation immediately after the stop condition. a write to the ccr requires both the rwel and wel bits to be set in a specific sequence. addr 7 6 5 4 3 2 1 0 003fh bat al1 al0 0 0 rwel wel rtcf default 0 0 0 0 0 0 0 1 x1226
8 fn8098.3 may 8, 2006 wel: write enable latch?volatile the wel bit controls the access to the ccr and mem- ory array during a write operati on. this bit is a volatile latch that powers up in the low (disabled) state. while the wel bit is low, writes to the ccr or any array address will be ignored (no acknowledge will be issued after the data byte). the wel bit is set by writing a ?1? to the wel bit and zeroes to the other bits of the status register. once set, wel remains set until either reset to 0 (by writing a ?0? to the wel bit and zeroes to the other bits of the status r egister) or until the part powers up again. writes to wel bi t do not cause a nonvolatile write cycle, so the device is ready for the next operation immediately after the stop condition. rtcf: real time clock fail bit?volatile this bit is set to a ?1? afte r a total power failure. this is a read only bit that is set by hardware (x1226 inter- nally) when the device powers up after having lost all power to the device (both v cc and v back go to 0v). the bit is set regardless of whether v cc or v back is applied first. the loss of only one of the supplies does not set the rtcf bit to ?1?. on power-up after a total power failure, all registers are set to their default states and the clock will no t increment until at least one byte is written to the clock register. the first valid write to the rtc section af ter a complete power failure resets the rtcf bit to ?0? (writing one byte is suffi- cient). unused bits: this device does not use bits 3 or 4 in the sr, but must have a zero in these bit positions. the data byte output during a sr read will contain zeros in these bit locations. control registers the control bits and regist ers, described under this section, are nonvolatile. block protect bits?bp2, bp1, bp0 the block protect bits, bp2, bp1 and bp0, determine which blocks of the array are write protected. a write to a protected block of memory is ignored. the block protect bits will prevent write operations to one of eight segments of the array. the partitions are described in table 3. interrupt control and frequency output register (int) interrupt control and status bits (im, al1e, al0e) there are two interrupt control bits, alarm 1 interrupt enable (al1e) and alarm 0 interrupt enable (al0e) to specifically enable or disable the alarm interrupt signal output (irq ). the interrupts are enabled when either the al1e and al0e bits are set to ?1?, respectively. table 3. block protect bits two volatile bits (al1 and al0), associated with the two alarms respectively, indicate if an alarm has happened. these bits are set on an alarm condition regardless of whether the irq interrupt is enabled. the al1 and al0 bits in the status register are reset by the falling edge of the eighth clock of a read of the register containing the bits. pulse interrupt mode the pulsed interrrupt mode allows for repetitive or recurring alarm functionalit y. hence an repetitive or recurring alarm can be set for every n th second, or n th minute, or n th hour, or n th date, or for the same day of the week. the pulsed interrupt mode can be consid- ered a repetitive interrupt mode, with the repetition rate set by the time setting fo the alarm. the pulse interrupt mode is enabled when the im bit is set. the alarm irq output will output a single pulse of short duration (approximately 10-40ms) once the alarm condition is met. if the interrupt mode bit (im bit) is set, then this pulse will be periodic. bp2 bp1 bp0 protected addresses x1226 array lock 0 0 0 none none 0 0 1 6000h ? 7fffh upper 1/4 0 1 0 4000h ? 7fffh upper 1/2 0 1 1 0000h ? 7fffh full array 1 0 0 0000h ? 007fh first page 1 0 1 0000h ? 00ffh first 2 pgs 1 1 0 0000h ? 01ffh first 4 pgs 1 1 1 0000h ? 03ffh first 8 pgs im bit interrupt/alarm frequency 0 single time event set by alarm 1 repetitive/recurring time event set by alarm x1226
9 fn8098.3 may 8, 2006 programmable frequency output bits?fo1, fo0 these are two output control bits. they select one of three divisions of the internal oscillator, that is applied to the phz output pin. table 4 shows the selection bits for this output. when using the phz output function, the alarm irq output function is disabled. table 4. programmable frequency output bits on-chip oscillator compensation digital trimming register (dtr) ? dtr2, dtr1 and dtr0 (non-volatile) the digital trimming bits dtr2, dtr1 and dtr0 adjust the number of counts per second and average the ppm error to achieve better accuracy. dtr2 is a sign bit. dtr2 = 0 means frequency compensation is > 0. dtr2 = 1 means frequency compensation is < 0. dtr1 and dtr0 are scale bits. dtr1 gives 10 ppm adjustment and dtr0 gives 20 ppm adjustment. a range from -30ppm to +30ppm can be represented by using three bits above. table 5. digital tr imming registers analog trimming register (atr) (non-volatile) six analog trimming bits from atr5 to atr0 are pro- vided to adjust the on-chip loading capacitance range. the on-chip load capacitance ranges from 3.25pf to 18.75pf. each bit has a di fferent weight for capaci- tance adjustment. using a citizen cfs-206 crystal with different atr bit combinations provides an esti- mated ppm range from +116ppm to -37ppm to the nominal frequency compensation. the combination of digital and analog trimming can give up to +146ppm adjustment. the on-chip capacitance can be calculated as follows: c atr = [(atr value, decimal) x 0.25pf] + 11.0pf note that the atr values are in two?s complement, with atr(000000) = 11.0pf, so the entire range runs from 3.25pf to 18.75pf in 0.25pf steps. the values calculated above are typical, and total load capacitance seen by the cr ystal will include approxi- mately 2pf of package and board capacitance in addi- tion to the atr value. see application section and intersil?s application note an154 for more information. writing to the clock/control registers changing any of the nonvolatile bits of the clock/control register re quires the following steps: ? write a 02h to the status register to set the write enable latch (wel). this is a volatile operation, so there is no delay after the write. (operation pre- ceeded by a start and ended with a stop). ? write a 06h to the status register to set both the register write enable latch (rwel) and the wel bit. this is also a volatile cycle. the zeros in the data byte are required. (operation preceeded by a start and ended with a stop). ? write one to 8 bytes to the clock/control registers with the desired clock, alarm, or control data. this sequence starts with a start bit, requires a slave byte of ?11011110? and an address within the ccr and is terminated by a stop bit. a write to the ccr changes eeprom values so these init iate a nonvolatile write cycle and will take up to 10m s to complete. writes to undefined areas have no effect. the rwel bit is reset by the completion of a nonvolatile write cycle, so the sequence must be repeated to again initiate another change to the ccr contents. if the sequence is not completed for any reason (by send- ing an incorrect number of bits or sending a start instead of a stop, for example) the rwel bit is not reset and the device rema ins in an active mode. ? writing all zeros to the stat us register resets both the wel and rwel bits. ? a read operation occurring between any of the previ- ous operations will not inte rrupt the regi ster write operation. fo1 fo0 output frequency (average of 100 samples) 00 alarm irq output 0 1 32.768khz 1 0 4096hz 11 1hz dtr register estimated frequency ppm dtr2 dtr1 dtr0 000 0 010 +10 001 +20 011 +30 100 0 110 -10 101 -20 111 -30 x1226
10 fn8098.3 may 8, 2006 serial communication interface conventions the device supports a bidirectional bus oriented proto- col. the protocol defines any device that sends data onto the bus as a transmitter, and the receiving device as the receiver. the device controlling the transfer is called the master and the device being controlled is called the slave. the mast er always initiates data transfers, and provides the clock for both transmit and receive operations. therefore, the devices in this fam- ily operate as slaves in all applications. clock and data data states on the sda line can change only during scl low. sda state changes during scl high are reserved for indicating start and stop conditions. see figure 3. start condition all commands are preceded by the start condition, which is a high to low transition of sda when scl is high. the device contin uously monitors the sda and scl lines for the start condition and will not respond to any command until this condition has been met. see figure 4. stop condition all communications must be terminated by a stop condition, which is a low to high transition of sda when scl is high. the stop condition is also used to place the device into the standby power mode after a read sequence. a stop condition can only be issued after the transmitting device has released the bus. see figure 4. acknowledge acknowledge is a software convention used to indi- cate successful data transfer. the transmitting device, either master or slave, will release the bus after trans- mitting eight bits. during the ninth clock cycle, the receiver will pull the sda line low to acknowledge that it received the eight bits of data. refer to figure 5. the device will respond with an acknowle dge after recognition of a start cond ition and if the correct device identifier and select bits are contained in the slave address byte. if a write operation is selected, the device will respond with an acknowledge after the receipt of each subsequent eight bit word. the device will acknowledge all incoming data and address bytes, except for: ? the slave address byte when the device identifier and/or select bits are incorrect ? all data bytes of a write when the wel in the write protect register is low ? the 2nd data byte of a status register write oper- ation (only 1 data byte is allowed) in the read mode, the device will transmit eight bits of data, release the sda line, then monitor the line for an acknowledge. if an acknowledge is detected and no stop condition is generate d by the master, the device will continue to transmit da ta. the device will terminate further data transmissions if an acknowledge is not detected. the master must then issue a stop condition to return the device to standby mode and place the device into a known state. figure 3. valid data changes on the sda bus scl sda data stable data change data stable x1226
11 fn8098.3 may 8, 2006 figure 4. valid start and stop conditions figure 5. acknowledge response from receiver device addressing following a start condition, the master must output a slave address byte. the first four bits of the slave address byte sp ecify access to either the eeprom array or to the ccr. slave bits ?1010? access the eeprom array. slave bits ?1101? access the ccr. when shipped from the factory, eeprom array is undefined, and should be programmed by the cus- tomer to a known state. bit 3 through bit 1 of the slave byte specify the device select bits. these are set to ?111?. the last bit of the slave address byte defines the operation to be performed. when this r/w bit is a one, then a read operation is selected. a zero selects a write operation. refer to figure 6. after loading the entire slave address byte from the sda bus, the x1226 compares the device identifier and device select bits wit h ?1010111? or ?1101111?. upon a correct compare, the device outputs an acknowledge on the sda line. following the slave byte is a two byte word address. the word address is either supplied by the master device or obtained from an internal counter. on power- up the internal address counter is set to address 0h, so a current addr ess read of the eeprom array starts at address 0. when required, as part of a random read, the master must supply the 2 word address bytes as shown in figure 6. in a random read operation, the slave byte in the ?dummy write? portion must match the slave byte in the ?read? section. that is if the random read is from the array the slave byte must be 1010111x in both instances. similarly, for a random read of the clock/control registers, the slave byte must be 1101111x in both places. scl sda start stop scl from master data output from transmitter data output from receiver 8 1 9 start acknowledge x1226
12 fn8098.3 may 8, 2006 figure 6. slave address, word address, and data bytes (64 byte pages) write operations byte write for a write operation, the device requires the slave address byte and the word address bytes. this gives the master access to any one of the words in the array or ccr. (note: prior to wr iting to the ccr, the master must write a 02h, then 06h to the status register in two preceding operations to enable the write operation. see ?writing to the clock/control registers.? upon receipt of each address byte, the x1226 responds with an acknowledge. after receiving both address bytes the x1226 awaits the eight bits of data. after receiving the 8 data bits, the x1226 again responds with an acknowledge. the master then terminates the transfer by generating a stop condition. the x1226 then begins an internal write cycle of the data to the nonvol- atile memory. during the internal write cycle, the device inputs are disabled, so the device will not respond to any requests from the master. the sda out- put is at high impedance. see figure 7. figure 7. byte write sequence figure 8. writing 30 bytes to a 64 -byte memory page starting at address 40 . slave address byte byte 0 d7 d6 d5 d2 d4 d3 d1 d0 a0 a7 a2 a4 a3 a1 data byte byte 3 a6 a5 00 000a8 0 1 1 0 1 1 0 1 0 1 1 r/w 1 device identifier array ccr 0 word address 1 byte 1 word address 0 byte 2 s t a r t s t o p slave address word address 1 data a c k a c k a c k sda bus signals from the slave signals from the master 0 a c k word address 0 1 1 1 1 0000000 address address 40 23 bytes 63 7 bytes address = 6 address pointer ends here addr = 7 x1226
13 fn8098.3 may 8, 2006 a write to a protected block of memory is ignored, but will still receive an acknowle dge. at the end of the write command, the x1226 wi ll not initiate an internal write cycle, and will continue to ack commands. page write the x1226 has a page write operation. it is initiated in the same manner as the byte write operation; but instead of terminating the wr ite cycle after the first data byte is transferred, the master can transmit up to 63 more bytes to the memory array and up to 7 more bytes to the clock/control regi sters. (note: prior to writ- ing to the ccr, the master mu st write a 02h, then 06h to the status register in two preceding operations to enable the write operation. see ?writing to the clock/control registers.? after the receipt of each byte, the x1226 responds with an acknowledge, and the address is internally incremented by one. when the counter reaches the end of the page, it ?rolls over? and goes back to the first address on the same page. this means that the master can write 64 bytes to a memory array page or 8 bytes to a ccr section starting at any location on that page. for example, if the master begins writing at location 60 of the memory and loads 30 bytes, then the first 23 bytes are written to addresses 40 through 63, and the last 7 bytes are written to columns 0 through 6. afterwards, the address counter would point to location 7 on the page that was just written. if the master supplies more than the maximum bytes in a page, then the previously loaded data is over written by the new data, one byte at a time. refer to figure 8. the master terminates the data byte loading by issu- ing a stop condition, which causes the x1226 to begin the nonvolatile write cycle. as with the byte write oper- ation, all inputs are disabled until completion of the internal write cycle. refer to figure 9 for the address, acknowledge, and data transfer sequence. stops and write modes stop conditions that terminat e write operations must be sent by the master after sending at least 1 full data byte and it?s associated ack signal. if a stop is issued in the middle of a data byte, or before 1 full data byte + ack is sent, then the x1226 resets itself without performing the write. the contents of t he array are not affected. figure 9. page write sequence word address 0 s t a r t s t o p slave address word address 1 data (n) a c k a c k a c k sda bus signals from the slave signals from the master 0 data (1) a c k 1 n 64 for eeprom array 1 n 8 for ccr 1 1 1 1 0000000 x1226
14 fn8098.3 may 8, 2006 acknowledge polling disabling of the inputs durin g nonvolatile write cycles can be used to take advant age of the typical 5ms write cycle time. once the stop condition is issued to indi- cate the end of the master?s byte load operation, the x1226 initiates the internal nonvolatile write cycle. acknowledge polling can begin immediately. to do this, the master issues a start condition followed by the memory array slave address byte for a write or read operation (aeh or afh). if the x1226 is still busy with the nonvolatile write cycle then no ack will be returned. when the x1226 has completed the write operation, an ack is returned and the host can pro- ceed with the read or write operation. refer to the flow chart in figure 11. note: do not use the ccr salve byte (deh or dfh) for acknowledge polling. read operations there are three basic read operations: current address read, random read, and sequential read. current address read internally the x1226 contains an address counter that maintains the address of the last word read incre- mented by one. therefore, if the last read was to address n, the next read operation would access data from address n+1. on power-up, the sixteen bit address is initialized to 0h. in this way, a current address read immediately after the power-on reset can download the entire contents of memory starting at the first location.upon receipt of the slave address byte with the r/w bit set to one, the x1226 issues an acknowledge, then transmits eight data bits. the mas- ter terminates the read operation by not responding with an acknowledge during the ninth clock and issu- ing a stop condition. refer to figure 10 for the address, acknowledge, and data transfer sequence. figure 11. acknowledge polling sequence it should be noted that the ninth clock cycle of the read operation is not a ?don?t care.? to terminate a read operation, the master must either issue a stop condi- tion during the ninth cycle or hold sda high during the ninth clock cycle and th en issue a stop condition. figure 10. current address read sequence ack returned? issue memory array slave address byte afh (read) or aeh (write) byte load completed by issuing stop. enter ack polling issue stop issue start no yes issue stop no continue normal read or write command sequence proceed yes nonvolatile write cycle complete. continue command sequence? s t a r t s t o p slave address data a c k sda bus signals from the slave signals from the master 1 1 1 1 1 x1226
15 fn8098.3 may 8, 2006 random read random read operations allow the master to access any location in the x1226. prior to issuing the slave address byte with the r/w bit set to zero, the master must first perform a ?dummy? write operation. the master issues the star t condition and the slave address byte, receives an acknowledge, then issues the word address bytes. after acknowledging receipt of each word address byte, the master immediately issues another start cond ition and the slave address byte with the r/w bit set to one. this is followed by an acknowledge from the device and then by the eight bit data word. the master terminates the read operation by not responding with an acknowledge and then issu- ing a stop condition. refer to figure 12 for the address, acknowledge, and data transfer sequence. in a similar operation called ?set current address,? the device sets the address if a stop is issued instead of the second start shown in figure 12. the x1226 then goes into standby mode after the stop and all bus activity will be ignored until a start is de tected. this operation loads the new address into the address counter. the next current address read operation will read from the newly loaded address. this operation could be useful if the master knows the next address it needs to read, but is not ready for the data. sequential read sequential reads can be initiated as either a current address read or random address read. the first data byte is transmitted as wit h the other modes; however, the master now responds with an acknowledge, indi- cating it requires additional data. the device continues to output data for each acknowledge received. the master terminates the r ead operation by not responding with an acknowledge and then issuing a stop condition. the data output is sequential, with the data from address n followed by the data from address n + 1. the address counter for read operations increments through all page and column addresses, allowing the entire memory contents to be serially read during one operation. at the end of the address space the counter ?rolls over? to the start of the address space and the x1226 continues to output data for each acknowledge received. refer to figure 13 for the acknowledge and data transfer sequence. figure 12. random address read sequence figure 13. sequential read sequence 0 slave address word address 1 a c k a c k s t a r t s t o p slave address data a c k 1 s t a r t sda bus signals from the slave signals from the master a c k word address 0 1 1 1 1 1 1 11 0000000 data (2) s t o p slave address data (n) a c k a c k sda bus signals from the slave signals from the master 1 data (n-1) a c k a c k (n is any integer greater than 1) data (1) x1226
16 fn8098.3 may 8, 2006 absolute maximum ratings temperature under bias ................... -65c to +135c storage temperature ........................ -65c to +150c voltage on v cc , v back and phz/irq pin (respect to ground) ....... .....................-0.5v to 7.0v voltage on scl, sda, x1 and x2 pin (respect to ground) .......... ..... -0.5v to 7.0v or 0.5v above v cc or v back (whichever is higher) dc output current .............................................. 5 ma lead temperature (soldering, 10s)................... 300c comment stresses above those liste d under ?absolute maximum ratings? may cause permanent damage to the device. this is a stress rating only and the functional operation of the device at these or any other conditions above those indicated in the opera tional sections of this specification is not implied. exposure to absolute max- imum rating conditions for extended periods may affect device reliability. dc operating characteristics (temperature = -40c to +85c, unless otherwise stated.) operating characteristics symbol parameter conditions min typ max unit notes v cc main power supply 2.7 5.5 v v back backup power supply 1.8 5.5 v v cb switch to backup supply v back -0.2 v back -0.1 v v bc switch to main supply v back v back +0.2 v symbol parameter conditions min typ max unit notes i cc1 read active supply cur- rent v cc = 2.7v 400 a 1, 5, 7, 14 v cc = 5.0v 800 a i cc2 program supply current (nonvolatile) v cc = 2.7v 2.5 ma 2, 5, 7, 14 v cc = 5.0v 3.0 ma i cc3 main timekeeping current v cc = 2.7v 10 a 3, 7, 8, 14, 15 v cc = 5.0v 20 a i back timekeeping current v back = 1.8v 1.25 a 3, 6, 9, 14, 15 ?see perfor- mance data? v back = 3.3v 1.5 a i li input leakage current 10 a 10 i lo output leakage current 10 a 10 v il input low voltage -0.5 v cc x 0.2 or v back x 0.2 v13 v ih input high voltage v cc x 0.7 or v back x 0.7 v cc + 0.5 or v back + 0.5 v13 v hys schmitt trigger input hysteresis v cc related level .05 x v cc or .05 x v back v13 v ol1 output low voltage for sda v cc = 2.7v 0.4 v11 v cc = 5.5v 0.4 v ol2 output low voltage for phz/irq v cc = 2.7v v cc x 0.3 v11 v cc = 5.5v v cc x 0.3 v oh2 output high voltage for phz/irq v cc = 2.7v v cc x 0.7 v12 v cc = 5.5v v cc x 0.7 x1226
17 fn8098.3 may 8, 2006 notes: (1) the device enters the active state after any start, and rema ins active: for 9 clock cycles if the device select bits i n the slave address byte are incorrect or until 200ns after a stop ending a read or write operation. (2) the device enters the program state 200ns after a stop ending a write operation and continues for t wc . (3) the device goes into the time keeping state 200ns after any stop, except those that initiate a nonvolatile write cycle; t wc after a stop that initiates a nonvolatile write cycle; or 9 clock cycles after any star t that is not followed by the correct device select b its in the slave address byte. (4) for reference only and not tested. (5) v il = v cc x 0.1, v ih = v cc x 0.9, f scl = 400khz (6) v cc = 0v (7) v back = 0v (8) v sda = v scl =v cc , others = gnd or v cc (9) v sda =v scl =v back , others = gnd or v back (10) v sda = gnd or v cc , v scl = gnd or v cc (11) i ol = 3.0ma at 5.5v, 1.5ma at 2.7v (12) i oh = -1.0ma at 5.5v, -0.4ma at 2.7v (13) threshold voltages based on the higher of vcc or vback. (14) using recommended crystal and oscillat or network applied to x1 and x2 (25c). (15) typical values are for t a = 25c capacitance t a = 25c, f = 1.0 mhz, v cc = 5v notes: (1) this parameter is not 100% tested. (2) the input capacitance between x1 and x2 pins can be varied between 5pf and 19. 75pf by using analog trimming registers ac characteristics ac test conditions figure 14. standard output load for testing the device with v cc = 5.0v symbol parameter max. units test conditions c out (1) output capacitance (sda, phz/irq )10pfv out = 0v c in (1) input capacitance (scl) 10 pf v in = 0v input pulse levels v cc x 0.1 to v cc x 0.9 input rise and fall times 10ns input and output timing levels v cc x 0.5 output load standard output load sda 1533 100pf 5.0v for v ol = 0.4v and i ol = 3 ma equivalent ac output load circuit for v cc = 5v 1316 5.0v phz/irq 100pf 806 x1226
18 fn8098.3 may 8, 2006 ac specifications (t a = -40c to +85c, vcc = +2.7v to +5.5v, unless otherwise specified.) notes: (1) this parameter is not 100% tested. (2) cb = total capacitance of one bus line in pf. timing diagrams bus timing symbol parameter min. max. units f scl scl clock frequency 400 khz t in pulse width suppression time at inputs 50 (1) ns t aa scl low to sda data out valid 0.1 0.9 s t buf time the bus must be free before a new transmission can start 1.3 s t low clock low time 1.3 s t high clock high time 0.6 s t su:sta start condition setup time 0.6 s t hd:sta start condition hold time 0.6 s t su:dat data in setup time 100 ns t hd:dat data in hold time 0 s t su:sto stop condition setup time 0.6 s t dh data output hold time 50 ns t r sda and scl rise time 20 +.1cb (2) 300 ns t f sda and scl fall time 20 +.1cb (2) 300 ns cb capacitive load for each bus line 400 pf t su:sto t dh t high t su:sta t hd:sta t hd:dat t su:dat scl sda in sda out t f t low t buf t aa t r x1226
19 fn8098.3 may 8, 2006 write cycle timing power-up timing notes: (1) delays are measured from the time v cc is stable until the specified operation can be initiated. these parameters are not 100% tested. v cc slew rate should be between 0.2mv/sec and 50mv/sec. (2) typical values are for t a = 25c and v cc = 5.0v nonvolatile write cycle timing note: (1) t wc is the time from a valid stop condition at the end of a writ e sequence to the end of the self-timed internal nonvolatile write cycle. it is the minimum cycle time to be allowed for any nonvolatile write by the user, unless ac knowledge polling is used. scl sda t wc 8th bit of last byte ack stop condition start condition symbol parameter min. typ. (2) max. units t pur (1) time from power-up to read 1 ms t puw (1) time from power-up to write 5 ms symbol parameter min. typ. (1) max. units t wc (1) write cycle time 5 10 ms x1226
20 fn8098.3 may 8, 2006 application section crystal oscillator and temperature compensation intersil has now integrated the oscillator compensation circuity on-chip, to eliminate the need for external components and adjust for crystal drift over tempera- ture and enable very high accuracy time keeping (<5ppm drift). the intersil rtc family uses an oscillator circuit with on-chip crystal compensation network, including adjustable load-capacitance. the only external com- ponent required is the crystal. the compensation net- work is optimized for operation with certain crystal parameters which are common in many of the surface mount or tuning-fork crystals available today. table 6 summarizes these parameters. table 7 contains some crystal manufacturers and part numbers that meet the requirements for the intersil rtc products. the turnover temperature in table 6 describes the temperature where the apex of the of the drift vs. tem- perature curve occurs. this curve is parabolic with the drift increasing as (t-t0) 2 . for an epson mc-405 device, for example, the turnover temperature is typi- cally 25 deg c, and a peak drift of >110ppm occurs at the temperature extremes of -40 and +85 deg c. it is possible to address this variable drift by adjusting the load capacitance of the crys tal, which will result in pre- dictable change to the crystal frequency. the intersil rtc family allows this ad justment over temperature since the devices include on- chip load ca pacitor trim- ming. this control is handled by the analog trimming register, or atr, which has 6 bits of control. the load capacitance range covered by the atr circuit is approximately 3.25pf to 18 .75pf, in 0.25pf incre- ments. note that actual capacitance would also include about 2pf of package related capacitance. in- circuit tests with commercially available crystals dem- onstrate that this range of capacitance allows fre- quency control from +116ppm to -37ppm, using a 12.5pf load crystal. in addition to the analog compensation afforded by the adjustable load capacitance, a digital compensation feature is available for the intersil rtc family. there are three bits known as t he digital trimming register or dtr, and they operate by adding or skipping pulses in the clock signal. the range provided is 30ppm in increments of 10ppm. the default setting is 0ppm. the dtr control can be used for coarse adjustments of frequency drift over temperature or for crystal initial accuracy correction. table 6. crystal parameters required for intersil rtc?s table 7. crystal manufacturers parameter min typ max units notes frequency 32.768 khz freq. tolerance 100 ppm down to 20ppm if desired turnover temperature 20 25 30 c typically the value used for most crystals operating temperature range -40 85 c parallel load capacitance 12.5 pf equivalent series resistance 50 k for best oscillator performance manufacturer part number te mp range +25c freq toler. citizen cm201, cm202, cm200s -40 to +85c 20ppm epson mc-405, mc-406 -40 to +85c 20ppm raltron rsm-200s-a or b -40 to +85c 20ppm saronix 32s12a or b -40 to +85c 20ppm ecliptek ecpsm29t-32.768k -10 to +60c 20ppm ecs ecx-306/ecx-306i -10 to +60c 20ppm fox fsm-327 -40 to +85c 20ppm x1226
21 fn8098.3 may 8, 2006 a final application for the atr control is in-circuit cali- bration for high accuracy applications, along with a temperature sensor chip. once the rtc circuit is powered up with battery backup, the phz output is set at 32.768khz and frequency drift is measured. the atr control is then adjusted to a setting which minimizes drift. once adjusted at a particular temper- ature, it is possible to adjust at other discrete temper- atures for minimal overall dr ift, and store the resulting settings in the eeprom. extremely low overall tem- perature drift is possible with this method. the intersil evaluation board contains the circuitry necessary to implement this control. for more detailed operation s ee intersil?s application note an154 on intersil?s w ebsite at www.intersil.com. layout considerations the crystal input at x1 has a very high impedance and will pick up high frequency signal s from other circuits on the board. since the x2 pin is tied to the other side of the crystal, it is also a s ensitive node. t hese signals can couple into the oscillato r circuit and produce double clocking or mis-clocking, se riously affecting the accu- racy of the rtc. care needs to be taken in layout of the rtc circuit to avoid noise pi ckup. below in figure 15 is a suggested layout for the x1226 or x1227 devices. figure 15. suggested layout for intersil rtc in so-8 the x1 and x2 connections to the crystal are to be kept as short as possible. a thick ground trace around the crystal is advised to minimize noise intrusion, but ground near the x1 and x2 pins should be avoided as it will add to the load capaci tance at those pins. keep in mind these guidelines for other pcb layers in the vicinity of the rtc device. a small decoupling capaci- tor at the vcc pin of the chip is mandatory, with a solid connection to ground. the x1226 product has a special consideration. the phz/irq- pin on the 8 ld soic package is located next to the x2 pin. when th is pin is used as a fre- quency output (phz) and is set to 32.768khz output frequency, noise can couple to the x1 or x2 pins and cause double-clocking. the layout in figure 15 can help minimize this by running the phz output away from the x1 and x2 pins. al so, minimizing the switch- ing current at this pin by careful selection of the pullup resistor value will reduce no ise. intersil suggests a minimum value of 5.1k for 32.768khz, and higher values (up to 20k ) for lower frequency phz outputs. for other rtc products, the same rules stated above should be observed, but adju sted slightly since the packages and pinouts are slightly different. assembly most electronic circuits do not have to deal with assembly issues, but with the rtc devices assembly includes insertion or solder ing of a live battery into an unpowered circuit. if a socket is soldered to the board, and a battery is inserted in final assembly, then there are no issues with operation of the rtc. if the battery is soldered to the board directly, then the rtc device vback pin will see some trans ient upset from either soldering tools or intermittent battery connections which can stop the circuit from oscillating. once the battery is soldered to the board, the only way to assure the circuit will start up is to momentarily (very short period of time!) short the vback pin to ground and the circuit will begin to oscillate. oscillator measurements when a proper crystal is selected and the layout guide- lines above are observed, the oscillator should start up in most circuits in less than one second. some circuits may take slightly longer, but startup should definitely occur in less than 5 seconds. when testing rtc cir- cuits, the most common impulse is to apply a scope probe to the circuit at the x2 pin (oscillator output) and observe the waveform. do not do this! although in some cases you may see a useable waveform, due to the parasitics (usually 10pf to ground) applied with the scope probe, there will be no useful information in that waveform other than the fact that the circuit is oscillat- ing. the x2 output is sens itive to capac itive impedance so the voltage levels and t he frequency will be affected by the parasitic elements in the scope probe. applying a scope probe can possibly cause a faulty oscillator to start up, hiding other iss ues (although in the intersil rtc?s, the internal circuitry assures startup when using the proper crystal and layout). x1226
22 fn8098.3 may 8, 2006 the best way to analyze the rtc circuit is to power it up and read the real time cl ock as time advances, or if the chip has the phz output, look at the output of that pin on an oscilloscope (afte r enabling it with the con- trol register, and using a pullup resistor for an open- drain output). alternaltively, the x1226 device has an irq- output which can be checked by setting an alarm for each minute. using the pulse interrupt mode set- ting, the once-per-minute interrupt functions as an indication of proper oscillation. backup battery operation many types of batteries can be used with the intersil rtc products. 3.0v or 3.6v lithium batteries are appropriate, and sizes are available that can power a intersil rtc device for up to 10 years. another option is to use a supercapacitor for applications where vcc may disappear intermittently for short periods of time. depending on the value of supercapacitor used, backup time can last from a few days to two weeks (with >1f). a simple silicon or schottky barrier diode can be used in series with vcc to charge the superca- pacitor, which is connected to the vback pin. do not use the diode to charge a battery (especially lithium batteries!). figure 16. supercapactor charging circuit since the battery switchov er occurs at vcc = vback- 0.1v (see figure 16), the battery voltage must always be lower than the vcc voltage during normal operation or the battery will be drained. the summary of conditions for backup battery opera- tion is given in table 8: table 8. battery backup operation *since vback>2.65v is higher than vtrip, the battery is powering the entire device 2.7-5.5v supercapacitor v ss v cc v back 1. example applicatio n, vcc=5v, vback=3.0v condition vcc vback vtrip iback notes a. normal operation 5.00 3.00 4.38 <<1a b. vcc on with no battery 5.00 0 4.38 0 c. backup mode 0?1.8 1.8-3.0 4.38 <2a timekeeping only 2. example applicatio n, vcc=3.3v,vback=3.0v condition vcc vback vtrip iback a. normal operation 3.30 3.00 2.65 <<1a b. vcc on with no battery 3.30 0 2.65 0 c. backup mode 0?1.8 1.8?3.0* 2.65 <2a* timekeeping only d. unwanted - vcc on, vback powering 2.65 - 3.30 > vcc 2.65 up to 3ma internal vcc = vback x1226
23 fn8098.3 may 8, 2006 referring to figure 16, vtrip applies to the ?internal vcc? node which powers the entire device. this means that if vcc is powered down and the battery voltage at vback is higher than the vtrip voltage, then the entire chip will be running from th e battery. if vback falls to lower than vtrip, then the chip shuts down and all out- puts are disabled except for the oscillator and time- keeping circuitry. the fa ct that the chip can be powered from vback is not necessarily an issue since standby current for the rtc devices is <2a for this mode (called ?main timekeeping current? in the data sheet). only when the serial interface is active is there an increase in supply current, and with vcc powered down, the serial interface will most likely be inactive. one way to prevent operation in battery backup mode above the vtrip level is to add a diode drop (silicon diode preferred) to the battery to insure it is below vtrip. this will also provi de reverse leakage protection which may be needed to get safety agency approval. one mode that should always be avoided is the oper- ation of the rtc device with vback greater than both vcc and vtrip (condition 2d in table 8). this will cause the battery to drain quickly as serial bus com- munication and non-volatile writes will require higher supplier current. performance data i back performance 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 i back vs. temperature multi-lot process variation data temperature c -40 25 60 85 i back (a) 3.3v 1.8v x1226
24 fn8098.3 may 8, 2006 x1226 small outline package family (so) gauge plane a2 a1 l l1 detail x 4 4 seating plane e h b c 0.010 b m ca 0.004 c 0.010 b m ca b d (n/2) 1 e1 e n n (n/2)+1 a pin #1 i.d. mark h x 45 a see detail ?x? c 0.010 mdp0027 small outline package family (so) symbol so-8 so-14 so16 (0.150?) so16 (0.300?) (sol-16) so20 (sol-20) so24 (sol-24) so28 (sol-28) tolerance notes a 0.068 0.068 0.068 0.104 0.104 0.104 0.104 max - a1 0.006 0.006 0.006 0.007 0.007 0.007 0.007 0.003 - a2 0.057 0.057 0.057 0.092 0.092 0.092 0.092 0.002 - b 0.017 0.017 0.017 0.017 0.017 0.017 0.017 0.003 - c 0.009 0.009 0.009 0.011 0.011 0.011 0.011 0.001 - d 0.193 0.341 0.390 0.406 0.504 0.606 0.704 0.004 1, 3 e 0.236 0.236 0.236 0.406 0.406 0.406 0.406 0.008 - e1 0.154 0.154 0.154 0.295 0.295 0.295 0.295 0.004 2, 3 e 0.050 0.050 0.050 0.050 0.050 0.050 0.050 basic - l 0.025 0.025 0.025 0.030 0.030 0.030 0.030 0.009 - l1 0.041 0.041 0.041 0.056 0.056 0.056 0.056 basic - h 0.013 0.013 0.013 0.020 0.020 0.020 0.020 reference - n 8 14 16 16 20 24 28 reference - rev. l 2/01 notes: 1. plastic or metal protrusions of 0.006? maximum per side are not included. 2. plastic interlead protrusions of 0.010? maximum per side are not included. 3. dimensions ?d? and ?e1? are measured at datum plane ?h?. 4. dimensioning and tolerancing per asme y14.5m - 1994
25 all intersil u.s. products are manufactured, asse mbled and tested utilizing iso9000 quality systems. intersil corporation?s quality certifications ca n be viewed at www.intersil.com/design/quality intersil products are sold by description only. intersil corpor ation reserves the right to make changes in circuit design, soft ware and/or specifications at any time without notice. accordingly, the reader is cautioned to verify that data sheets are current before placing orders. information furnishe d by intersil is believed to be accurate and reliable. however, no responsibility is assumed by intersil or its subsidiaries for its use; nor for any infringements of paten ts or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of intersil or its subsidiari es. for information regarding intersil corporation and its products, see www.intersil.com fn8098.3 may 8, 2006 x1226 thin shrink small outlin e plastic packages (tssop) index area e1 d n 123 -b- 0.10(0.004) c a m bs e -a- b m -c- a1 a seating plane 0.10(0.004) c e 0.25(0.010) b m m l 0.25 0.010 gauge plane a2 notes: 1. these package dimensions are wi thin allowable dimensions of jedec mo-153-ac, issue e. 2. dimensioning and tolerancing per ansi y14.5m - 1982. 3. dimension ?d? does not include mold flash, protrusions or gate burrs. mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. dimension ?e1? does not include in terlead flash or protrusions. inter- lead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side. 5. the chamfer on the body is optional. if it is not present, a visual index feature must be located within the crosshatched area. 6. ?l? is the length of terminal for soldering to a substrate. 7. ?n? is the number of terminal positions. 8. terminal numbers are shown for reference only. 9. dimension ?b? does not include dam bar protrusion. allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of ?b? dimen- sion at maximum material conditi on. minimum space between protru- sion and adjacent lead is 0.07mm (0.0027 inch). 10. controlling dimension: millimete r. converted inch dimensions are not necessarily exact. (angles in degrees) 0.05(0.002) m8.173 8 lead thin shrink narrow body small outline plastic package symbol inches millimeters notes min max min max a - 0.047 - 1.20 - a1 0.002 0.006 0.05 0.15 - a2 0.031 0.051 0.80 1.05 - b 0.0075 0.0118 0.19 0.30 9 c 0.0035 0.0079 0.09 0.20 - d 0.116 0.120 2.95 3.05 3 e1 0.169 0.177 4.30 4.50 4 e 0.026 bsc 0.65 bsc - e 0.246 0.256 6.25 6.50 - l 0.0177 0.0295 0.45 0.75 6 n8 87 0 o 8 o 0 o 8 o - rev. 1 12/00

▲Up To Search▲

Price & Availability of X122606

	To Download X122606 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .